Stpete Electronics
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Featuring a porous structure as its core advantage, the P-2235-G2 Shielding Cover provides an integrated solution combining efficient heat dissipation and electromagnetic protection, optimized for high-end electronic devices.
The through-hole pin design enables secure through-hole soldering to the PCB. This configuration offers superior mechanical stability, preventing detachment and cold solder joints in high-vibration applications.
Manufactured from high-purity conductive alloys with optional copper-nickel alloy or tin-plated cold-rolled steel. The design supports SMT automated assembly and complies with CE, FCC, and RoHS standards.
This Shielding Cover is equipped with uniformly distributed high-density precision perforations on its surface. The hole positions are optimized through both electromagnetic and thermal simulations, ensuring efficient EMI shielding effectiveness that effectively blocks external electromagnetic interference and internal signal leakage across the 100MHz to 10GHz frequency band. Meanwhile, it provides sufficient heat dissipation channels for PCB components inside the package, preventing performance degradation or device aging caused by heat accumulation, making it ideal for high-power, highly integrated wireless communication and industrial control modules.
The product is formed through precision stamping and eco-friendly electroplating processes. The tin/nickel plating on the surface enhances corrosion resistance and solderability. The aperture, spacing, and layout of the porous structure can be customized according to specific requirements, flexibly balancing heat dissipation efficiency and shielding effectiveness.
Widely used in wireless communication modules, IoT smart gateways, automotive ECUs, industrial control motherboards, and other fields, it meets high demands for equipment stability, heat dissipation efficiency, and electromagnetic compatibility. Automated tape-and-reel packaging is fully compatible with SMT assembly, enabling efficient deployment and reducing assembly costs. Full customization support is available for dimensions, hole patterns, materials, and surface treatments, accommodating scale demands from prototype sampling to high-volume mass production.
The P-2235-G2 Through-hole Shielding Cover effectively blocks external electromagnetic interference and internal signal leakage across the 100MHz to 10GHz frequency band, optimized via electromagnetic and thermal simulations.
The high-density precision perforations act as dedicated heat dissipation channels for the PCB components inside the package. This prevents heat accumulation, reducing the risk of performance degradation and device aging in high-power wireless communication and industrial control modules.
Compared to surface-mount options, the through-hole pin design enables direct soldering into the PCB. This provides a stronger mechanical connection that resists detachment and cold solder joints in high-vibration environments, while maintaining a continuous ground loop for enhanced signal stability.
The shielding cover is crafted from high-purity conductive alloys, with copper-nickel alloy or tin-plated cold-rolled steel options. The surface electroplating (tin/nickel) improves corrosion resistance and enhances solderability during assembly.
Yes, customization is supported for dimensions, hole patterns, apertures, spacing, materials, and surface treatments to balance shielding performance and heat dissipation requirements.
Yes, the products support tape-and-reel packaging compatible with automated SMT placement machinery. This, in combination with through-hole reliability, simplifies assembly processes and reduces overall production costs.
