The SFP-W009 optical module housing is a precision structural component designed specifically for medium-to-high speed optical communication scenarios. Guided by the core design concept of "high stability + strong adaptability", it provides reliable protection and performance support for SFP+ and SFP28 modules with 10G/25G data rates.
High-quality aluminum alloy combines mechanical strength (tensile strength ≥ 290MPa) and high thermal conductivity (reaching 155W/(m·K), which is 18% higher than ordinary aluminum alloy) to quickly conduct heat from internal chips and prevent high-temperature degradation.
5-axis CNC machining controls dimensional tolerances within ±0.02mm, ensuring precise fits and preventing assembly gap signal interference. The hard anodized surface (12-15μm thick) resists scratching, fingerprints, and mild corrosion, passing a 48-hour salt spray test.
Features integrated heat dissipation ribs and side diversion grooves to reduce operating temperatures by 3-5℃. Optimized joint design offers electromagnetic radiation suppression conforming to EN 55032 Class B standards, shielding transmission from interference.
Strictly adheres to the IEC 60837 standard. It is fully compatible with mainstream SFP sizes (10G Ethernet and 25G Fibre Channel) without line adjustments. Custom interface openings, colors (default black, optional silver/gray), and laser-engraved logos are supported.
Every batch undergoes stringent testing: high-low temperature cycling (-40℃ to 85℃, 100 cycles), vibration impacts (10-2000Hz, 10g acceleration), and airtightness validation (pressure difference ≤ 5kPa/24h). Complying with telecom-grade GR-63-CORE and industrial-grade IEC 60068 standards, it serves as a robust protection barrier for data center servers, 5G base station fronthaul, and industrial optical systems.