CE Certification SRY10-014-P7 Suppliers, Exporters

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CE Certification SRY10-014-P7 Suppliers, Exporters

Die-cast heat sinks serve as core thermal management components for consumer electronics. Made from high thermal conductivity aluminum alloys such as ADC12 and A380, they are integrally formed via high-pressure die-casting, ideal for scenarios including mobile phones, computers, LED lighting fixtures and 5G devices.

With a thermal conductivity of 96–120 W/(m·K) and a dense fin design featuring a fin height ratio of over 10:1, these heat sinks rapidly dissipate heat generated by chips and processors, delivering ultra-low thermal resistance to prevent device performance throttling or shutdowns caused by overheating.

Capable of precision molding with 0.5mm thin walls and a surface roughness of only Ra1.6–3.2μm, the heat sinks undergo anodization for enhanced corrosion resistance and lightweight performance, weighing over 30% less than traditional heat dissipation parts.

Boasting fast die-casting cycles ranging from seconds to minutes, they are suited for high-volume production. Their flexible structural design allows customization to fit the complex contours of electronic devices, balancing superior thermal efficiency with minimal internal space occupation, making them the optimal choice for reconciling performance, cost and size requirements.

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Product Description

Product Overview

High-Efficiency Thermal Management

As a high-efficiency thermal management solution specifically designed for consumer electronics, the SRY10-014-P7 die-cast heat sink is manufactured from ADC12 high-thermal-conductivity aluminum alloy and integrally formed via an 800-ton high-pressure die-casting process. It serves as a core cooling component for compact communication devices such as optical modems, routers, and smart set-top boxes.

Core Mechanisms

Innovative Dissipation Principles

Its heat dissipation principle relies on two core mechanisms: Firstly, the ADC12 aluminum alloy substrate boasts a high thermal conductivity of 105 W/(m·K), which is approximately 30% more efficient than ordinary aluminum alloys. This exceptional thermal conductivity enables rapid transfer of heat generated by core components (e.g., optical modem chips and power modules) to the heat sink base in milliseconds, significantly reducing heat accumulation time.

Secondly, the heat sink features an innovative fin design with a 10:1 fin height ratio. Verified by thermal flow simulation, this structure allows the effective heat dissipation area of a single unit to exceed 220 cm², nearly 2.5 times that of traditional flat-plate heat sinks. The dense fin array works with natural convection to accelerate air flow over the heat sink surface, achieving a measured air velocity of 0.8 m/s under standard operating conditions and significantly enhancing heat exchange efficiency with the external environment.

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Proven Performance

Practical Application & Stress Testing

In practical optical modem applications, this thermal management system delivers outstanding performance. Under a 25℃ room temperature environment, after 72 hours of continuous full-load stress testing, the temperature of the optical modem’s core components equipped with this heat sink remains stably controlled below 58℃, well below the industry standard threshold of 75℃.

This temperature control performance is crucial for maintaining stable 10G PON broadband connections, preventing signal attenuation, packet loss, and other issues caused by overheating, and ensuring users enjoy a smooth experience during high-load scenarios such as prolonged high-speed downloads and 4K video playback.

Key Engineering Metrics

Additionally, the heat sink adopts a 1.2mm thin-wall precision structure, combined with high-precision CNC machining, to strictly control the surface roughness within Ra2.0μm, ensuring millimeter-level precise fit with the limited internal space of optical modems. The black electrostatic spraying on the surface not only provides an aesthetically pleasing appearance but also forms a protective coating with a thickness of 80μm. Tested by professional laboratories, this coating offers electromagnetic shielding effectiveness of ≥60dB, effectively resisting external electromagnetic interference. Meanwhile, the nano-scale oil-repellent structure on the coating surface achieves a fingerprint resistance of 4H hardness standard, balancing practicality and durability.

Compatibility & Installation

Wide Compatibility & Mass Production

Beyond optical modems, this heat sink is also compatible with compact WiFi6 routers and smart speaker amplifier modules: its thermal resistance of 0.8℃/W can support heat dissipation requirements of up to 15W, and its lightweight design (only 18g) does not compromise device portability. The modular mounting holes are compatible with mainstream PCB layouts, greatly simplifying manufacturers’ assembly processes.

Leveraging the mass production advantages of die-casting technology, the SRY10-014-P7 balances cost and performance, meeting the "miniaturization, high reliability, and low cost" requirements of consumer electronics. It has become a designated supporting component for multiple communication equipment manufacturers.

Frequently Asked Questions

What is the manufacturing material and process of the SRY10-014-P7 heat sink?

The SRY10-014-P7 die-cast heat sink is manufactured using ADC12 high-thermal-conductivity aluminum alloy and is integrally formed via an 800-ton high-pressure die-casting process.

How does the thermal conductivity of this heat sink compare to ordinary alloys?

The ADC12 aluminum alloy substrate features a high thermal conductivity of 105 W/(m·K), which is approximately 30% more efficient than standard aluminum alloys, facilitating rapid heat transfer in milliseconds.

What kind of performance does the SRY10-014-P7 deliver in full-load testing?

Under a 25℃ room temperature environment and after 72 hours of continuous full-load stress testing, core component temperatures remain controlled below 58℃, well below the industry standard threshold of 75℃.

Does the surface coating offer electromagnetic shielding?

Yes, the 80μm thick black electrostatic spraying coating provides electromagnetic shielding effectiveness of ≥60dB, which effectively shields devices against external electromagnetic interference.

What types of consumer electronics are compatible with this heat sink?

It is widely compatible with optical modems (10G PON), compact WiFi6 routers, and smart speaker amplifier modules, supporting thermal dissipation demands up to 15W with a thermal resistance of 0.8℃/W.

What is the weight and design adaptability of this component?

The heat sink features a lightweight design of only 18g and is engineered with modular mounting holes compatible with mainstream PCB layouts, simplifying device assembly.