High-Quality SRY17-021-P7 Suppliers, Exporters

SRY17-021-P7 Die-cast Heat Sink is an Efficient Heat Sink engineered specifically for electronic devices. Formed via a precision die-casting process, it boasts a sturdy structure and scientifically arranged heat dissipation fins, which can quickly conduct and dissipate heat generated by components like battery cells and power modules during operation.

Its compact T-shaped structure fits various installation spaces. The black surface treatment not only enhances corrosion resistance but also boosts thermal radiation efficiency, stably maintaining the operating temperature of devices and preventing overheating damage. Whether for motherboard chips, small industrial control equipment, or consumer electronics components, this high-efficiency heat sink provides reliable cooling support, making it a practical accessory to improve device operational stability.

Product Description

Product Overview

As a source manufacturer specializing in the R&D and production of extruded and die-cast heat sinks, we launch the SRY17-021-P7, a Consumer Electronics Extruded Heat Sink tailor-made for the consumer electronics sector. It accurately meets the urgent heat dissipation needs of current miniaturized and highly integrated consumer devices.

This product adopts the precision extrusion molding process of 6063 aluminum alloy, combined with a scientific fin arrangement design, and undergoes professional surface treatment, making it a Black Anodized Extruded Heat Sink with both performance and durability.

Key Features

Anodized Protection

The black anodized layer endows the product with a delicate matte appearance, significantly improves corrosion resistance, and enhances thermal radiation heat dissipation efficiency. It maintains stable performance in humid and dusty environments.

Optimized T-Shaped Structure

Designed with a compact T-shaped structure adapted to internal spaces of optical modems and routers. Fin density is optimized via thermal simulation to maximize the heat dissipation area within a limited volume.

Application & Quality Control

The SRY17-021-P7 covers mainstream network communication equipment such as optical modems, routers, and network set-top boxes. The production line supports small-batch trial production and large-scale delivery, strictly following the ISO9001 quality standard. Each batch undergoes rigorous reliability tests including salt spray and thermal shock to ensure consistent quality.

With the accelerated iteration of the consumer electronics industry, the SRY17-021-P7 helps balance device miniaturization and heat dissipation stability with a highly cost-effective solution. Full-link services from sample proofing to custom optimization are available.

Frequently Asked Questions (FAQ)

What are the main applications of the SRY17-021-P7 heat sink?

It is designed for consumer electronics, specifically network communication equipment such as optical modems, routers, and network set-top boxes.

What material and process are used for manufacturing?

It is manufactured using the precision extrusion molding process of 6063 aluminum alloy, combined with a scientific fin arrangement design.

What are the benefits of the black anodized surface treatment?

The black anodized surface provides a matte appearance, improves corrosion resistance, and enhances thermal radiation heat dissipation efficiency, ensuring long-term durability in humid or dusty environments.

Is the SRY17-021-P7 customizable?

Yes. Details such as opening holes, trimming, and overall dimensions can be fine-tuned according to specific customer requirements.

What installation methods does this heat sink support?

It supports various installation methods including snap-on and screw fixing to adapt to the motherboard layouts of different devices.

What quality assurance standards are followed?

Production follows the ISO9001 quality standard, and each batch of products undergoes reliability tests such as salt spray and thermal shock to guarantee performance.

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