As a source manufacturer specializing in the R&D and production of extruded and die-cast heat sinks, we launch the SRY17-021-P7, a Consumer Electronics Extruded Heat Sink tailor-made for the consumer electronics sector. It accurately meets the urgent heat dissipation needs of current miniaturized and highly integrated consumer devices.
This product adopts the precision extrusion molding process of 6063 aluminum alloy, combined with a scientific fin arrangement design, and undergoes professional surface treatment, making it a Black Anodized Extruded Heat Sink with both performance and durability.
The black anodized layer endows the product with a delicate matte appearance, significantly improves corrosion resistance, and enhances thermal radiation heat dissipation efficiency. It maintains stable performance in humid and dusty environments.
Designed with a compact T-shaped structure adapted to internal spaces of optical modems and routers. Fin density is optimized via thermal simulation to maximize the heat dissipation area within a limited volume.
The SRY17-021-P7 covers mainstream network communication equipment such as optical modems, routers, and network set-top boxes. The production line supports small-batch trial production and large-scale delivery, strictly following the ISO9001 quality standard. Each batch undergoes rigorous reliability tests including salt spray and thermal shock to ensure consistent quality.
With the accelerated iteration of the consumer electronics industry, the SRY17-021-P7 helps balance device miniaturization and heat dissipation stability with a highly cost-effective solution. Full-link services from sample proofing to custom optimization are available.